Conductive Material for Multilayer Boards

Methode Development Company, Chicago, IL, recently introduced its 1210 Silver Conductive Via Plugging Ink for use in high-density interconnect applications. It provides low-cost blind and buried vias on double-sided and multi-layer PC boards, while enhancing the boards' reliability. This ink is ideal for applications such as cellular communications, telecommunications, consumer electronics, pagers, automotive electronics, personal computers and peripherals.

This 100%-solids ink has virtually no shrinkage on curing, and results in boards that are fully planar, more reliable, and less expensive to produce. It eliminates many of the expensive plating and lamination steps required to manufacture sequentially built-up PC boards. The ink can be used with or without through hole plating.

With this new plugging ink, PC board designers can replace traditional fan-out designs with via-in-pad designs, thereby using less real estate. The result is higher density products, with no sacrifice in performance or reliability.

The 1210 Silver Conductive Via Plugging Ink has a glass transition temperature (Tg) of 120° C, and a coefficient of temperature expansion (CTE) of 40ppm/°C from -50 to 120° C. Shelf life is thirty days at room temperature, and three months at -10° C.

For more information, contact Methode Development Company, 7447 West Wilson Avenue, Chicago, IL 60656. 800-323-6858.
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Originally published in the November  1998 issue of designfax.
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